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PCB工程英文翻译公司

作者：茂名翻译公司发布时间：2018-06-22 15:02:25 点击率：

工程英文确认常用词及常用语句汇总

厚度	公差	线路层	孔层	阻焊层
字符层	外形层	叠层

单词

1. 附件：attached

2. 样品：sample

3. 承认：approval

4. 答复：answer;reply

5. 规格：spec

6. 与...同样的：the same as

7. 前版本：previous version(old version)

8. 生产：production

9. 确认：confirm

10. 再次确认：double confirm

11. 工程问题：engineering query（EQ）

12. 尽快：ASAP(as soon as possible)

13. 生产文件：production gerber

14. 联系某人：contact somebody

15. 提交样板：submit sample

16. 交货期：delivery date

17. 电测成本：ET（electrical test） cost

18. 通断测试：Open and short testing

19. 参考：refer to

20. IPC标准：IPC standard

21. IPC二级：IPC class 2

22. 可接受的：acceptable

23. 允许：permit

24. 制造：manufacture

25. 修改：revision

26. 公差：tolerance

27. 忽略：ignore(omit)

28. 工具孔：tooling hole

29. 安装孔：mounting hole

30. 元件孔：component hole

31. 槽孔：slot

32. 邮票孔：snap off hole

33. 导通孔：via

34. 盲孔： blind via

35. 埋孔：buried via

36. 金属化孔：PTH(plating through hole)

37. 非金属化孔：NPTH( no plating through hole)

38. 孔位：hole location

39. 避免：avoid

40. 原设计：original design

41. 修改：modify

42. 按原设计：leave it as it is

43. 附边：waste tab

44. 铜条：copper strip

45. 拼板强度：panel strong

46. 板厚：board thickness

47. 删除：remove(delete)

48. 削铜：shave the copper

49. 露铜：copper exposure

50. 光标点：fiducial mark

51. 不同：be different from(differ from)

52. 内弧：inside radius

53. 焊环：annular ring

54. 单板尺寸：single size

55. 拼板尺寸：panel size

56. 铣：routing

57. 铣刀：router

58. V-cut：scoring

59. 哑光：matt

60. 光亮的：glossy

61. 锡珠：solder ball(solder plugs)

62. 阻焊：solder mask(solder resist)

63. 阻焊开窗：solder mask opening

64. 单面开窗：single side mask opening

65. 补油：touch up solder mask

66. 补线：track welds

67. 毛刺：burrs

68. 去毛刺：deburr

69. 镀层厚度：plating thickness

70. 清洁度：cleanliness

71. 离子污染：ionic contamination

72. 阻燃性：flammability retardant

73. 黑化：black oxidation

74. 棕化：brown oxidation

75. 红化：red oxidation

76. 可焊性：solderability

77. 焊料：solder

78. 包装：packaging

79. 角标：corner mark

80. 特性阻抗：characteristic impedance

81. 正像：positive

82. 负片：negative

83. 镜像：mirror

84. 线宽：conductor width

85. 线距：conductor spacing

86. 做样：build sample

87. 按照：as per

88. 成品：finished

89. 做变更：make the change

90. 相类似：similar to

91. 规格：specification

92. 下移：shift down

93. 垂直地：vertically

94. 水平的：horizontally

95. 增大：increase

96. 缩小：decrease

97. 表面处理：Surface Finishing

98. 波峰焊：wave solder

99. 钻孔数据：drilling date

100. 标记：Logo

101. Ul 标记：Ul Marking

102. 蚀刻标记：etched marking

103. 周期：date code

104. 翘曲：bow and twist

105. 外层：outer layer

106. 内层：internal layer

107. 顶层：top layer

108. 底层：bottom layer

109. 元件面：component side

110. 焊接面：solder side

111. 阻焊层：solder mask layer

112. 丝印层：legend layer (silkscreen layer or over layer)

113. 兰胶层：peelable SM layer

114. 贴片层：paste mask layer

115. 碳油层：carbon layer

116. 外形层：outline layer(profile layer)

117. 白油：white ink

118. 绿油：green ink

119. 喷锡：hot air leveling (HAL)

120. 水金：flash gold

121. 插头镀金：plated gold edge-board contacts

122. 金手指：Gold-finger

123. 防氧化：Entek(OSP)

124. 沉金：Immersion gold (chem. Gold)

125. 沉锡：Immersion Tin(chem.Tin)

126. 沉银：Immersion Silver (chem. silver)

127. 单面板：single sided board

128. 双面板：double sided board

129. 多层板：multilayer board

130. 刚性板：rigid board

131. 挠性板：flexible board

132. 刚挠板：flex-rigid board

133. 铣：CNC (mill , routing)

134. 冲：punching

135. 倒角：beveling

136. 倒斜角：chamfer

137. 倒圆角：fillet

138. 尺寸：dimension

139. 材料：material

140. 介电常数：Dielectric constant

141. 菲林：film

142. 成像：Imaging

143. 板镀：Panel Plating

144. 图镀：Pattern Plating

145. 后清洗：Final Cleaning

146. 叠层：layup (stack-up)

147. 污染焊盘：contaminate pad

148. 分孔图：drill chart

149. 度数：degree

150. 被…覆盖：be covered with

151. 负公差：minus tolerance

152. 标靶盘： target pad

153. 外形公差：routing tolerance

154. 芯板：core

常用语句

－、厚度

1. 要求孔内铜厚0.001"太紧对我们的生产，建议按IPC二级0.0008"。

The copper thickness of the wall of the plated-through holes is specified 0.001". It's too tight for our production. We suggest as per IPC class 2.that's to say ,It's 0.0008" .

2.要求金手指镀金厚度为1.2-1.5um，我们加工太困难，建议按我们常规0.45um。

The plating thickness of Au in edge contact is specified 1.2-1.5um,it is too tough for us, we suggest following our normal standard ,that is to say 0.45um instead.

3.建议所要求的铜厚2OZ为成品铜厚，而且我们将用基铜1.5OZ电镀到2OZ。

The copper thickness is specified 2OZ .We suggest the finished copper thickness 2OZ. And we will use the base material with 1.5OZ copper thickness and plate to 2OZ for our production.

4.要求锡厚为0.0005-0.003"，我们做不到这么厚，建议按IPC二级，即保证可焊性，

The solder thickness is required to plated 0.0005-0.003" ,We can not reach the requirement .We suggest following IPC class 2 for the solder thickness and we will assure the solderability.

二、公差

1. XXX.的尺寸公差为+/-0.005，这要求是太紧对我们生产，建议公差放松到+/-0.008"。

The tolerance of dimension is specified XXX.+/-0.005" .It is tight for our production .We suggest +/-0.008" instead。

2.在*.pdf文件中要求外形公差为+/-0.005"，建议按IPC 二级+/-0.01"代替。

The profile tolerance is specified +/-0.005" in *.pdf file. We suggest as per IPC class 2，that is to say, it is +/-0.01".

3. 在叠层图中要求板厚公差为+/-0.007"，而notes 1中要求板厚公差为+/-0.005"，他们是不同的，建议0.062"+/-0.007"是可接受的，因为+/-0.005"对我们来说太难控制了。

The tolerance of the board thickness is specified +/-0.007" in layup detail which is different form NOTES 1 +/-0.005".We suggest 0.062"+/-0.007" is acceptable for +/-0.005" is very tough for us to control.

4.外形公差要求+/-0.1mm，这超出了我们生产，建议按+/-0.2mm控制。

The tolerance of the outline is specified +/-0.1mm.It's above us.We suggest +/-0.2mm instead.

5. v-cut留厚公差为+/-0.06mm上下偏移公差为+/-0.05mm，这两个公差都太紧，建议两个公差都按+/-0.1mm控制。

The remain tolerance of v-cut is specified +/-0.06mm and offset tolerance is +/-0.05mm. they are too tight for us,we suggest both tolerance are +/-0.1mm instead.

6.孔位公差为0.05mm，这是太紧对我们，建议用+/-0.076mm替代。

The tolerance of the hole position is specified 0.05mm. It's too tight for us, We suggest +/-0.076mm instead.

7. 角度公差为+/-0.5mm，这是太紧对我们，v-cut角度我们将控制在30+/-5度。

The tolerance of angle is +/-0.5 degree ,it is tight for us , we would like to control the angle of v-cut within 30+/-5 degree.

8.在1MB5476-01.pdf文件中要求孔到板中心的公差是+/-0.05mm，这是太紧对我们，建议安IPC二级。

It is special that the tolerance of the hole to board center is +/-0.05mm in the 1MB5476-01.pdf file,it is too tight for us ,we suggest as per IPC class 2 .

9.要求线宽和线间距公差为+/-0.03，这是太紧对我们，请确认放松到+/-20%。

It stated that conductor width and spacing shall be within +/-0.03(0.001) of gerber data , it is tight for us , we would like to relax to +/-20%.Pls confirm.

10.Φ3.0的孔径公差要求+0.05mm，这太紧对我们，请确认放松到+0.1/-0mm。

The tolerance of the holes with diameter 3.0mm is required to control within +0.05mm ,it is tight for us , we would like to relax to +0.1/-0mm.Pls confirm.

三、线路层

1.两个孔到外形很近，这将引起露铜和破孔，建议允许露铜与破孔。

Two holes are near the outline,it will cause copper exposed and hole broken,we suggest copper exposed and hole broken is permitable.

2.有些盘离外形很近，建议削铜皮0.4mm，避免露铜。

Some pads are close to the outline .We suggest shaving the pads about 0.4mm avoid to the copper exposure.

3. 焊盘延伸出板外，如按原设计，板边将会露铜，建议允许露铜。

The copper pad extend to the board outline, it will lead to copper exposed if we follow Gerber to do,We suggest copper exposed is acceptable.

4.有三个盘离v-cut 线很近将会引起露铜，建议削焊盘0.4mm避免露铜。

The three pads are so close to the v-cut that they will cause copper exposure. We suggest shaving the pads 0.4mm avoid to the copper exposure.

5.底层有些地方线路网格间距仅有0.178mm，这种网格间距我们生产无法做到，建议减小线宽使间距达到0.2mm.

The copper grids on bottom side is only 0.178mm in some places,we can not do it per this gap,so we suggest decreasing the trace width to make copper grids to 0.2mm.

6. 既然没有功能上的影响，我们建议所有层附边均加些铜皮以提高电镀质量。

We suggest putting some extra copper on the waste tab in all layers to improve plating quality since this is no function effect.

7.建议加在顶层空白区域加些铜以提高电镀质量。

We suggest putting some copper in blank area on top side to improve plated quality.

8.我们发现有两处铜皮间距仅有0.013mm，建议把它们连接起来。

We have found that the gap between two block copper is only 0.013mm on bottom side,we suggest they are connected.

9. 两个光标点处在v-cut线上，它们将被削到，我们建议向左边移1.0mm。

The two fiducial marks are over v-groove line . They will be cut . We suggest moving them 1.0mm toward the left .

四、孔层

1. 两个直径2.0MM的孔，4个直径4.0MM的孔，4个直径1.3MM的孔双面没有焊盘，但它们被定义成PTH孔，我们建议做NPTH孔

The 2 holes with dia.2.0mm , 4 holes with dia.4.0mm and 4 holes with dia.1.3mm have no pads on top and bottom copper layer .But they are specified PTH in drill chart. We suggest build them as NPTH.

2．这些孔（直径1.4MM，1.6mm,1.8mm,2.5mm）被定义成PTH孔，但它们的焊盘与孔径等大，我们建议做NPTH孔。

These holes (1.4mm ,1.6mm,1.8mm,2.5mm)are specified PTH .But they have pads which are the same as the holes in copper layer .We suggest them NPTH.

3.六个直径0.25MM的孔在分孔图中定义为NPTH孔，但它们的线路焊盘比孔大，我们建议做PTH孔。

The 6 holes with dia.0.25mm are specified NPTH in drill chart .But they have pads which are larger than the holes in copper layers .We sugget them PTH .

4. 直径0.11“的孔对应的焊盘比孔大，但它们被定义成NPTH孔，我们建议沿孔边削铜皮0.3MM ，请确认

The hole with dia.0.11" have pad which is larger than the hole in top and bottom copper layer .But it's specified NPTH.we suggest shaving the pads 0.3mm around the hole.Pls confirm.

5.GERBER中孔的类型没有定义，2个直径0.120“的孔双面没有焊盘，我们想确认这2个直径0.120”的孔为NPTH孔。

The hole type(PTH or NPTH) did not be define in the Gerber, the two holes of diameter 0.120 inch have not copper pads on both sides, we would like to confirm the two holes of diameter 0.120 inch are non-plating holes, please confirm .

6.一些1.5mm的孔靠得非常近，建议把他们制成槽孔。

Some holes with dia.1.5mm are very close each other, we suggest doing them oval hole.

7.有两个Φ0.991、Φ0.762重叠在一起，建议保留一个0.991mm的孔。

There are two holes with dia.0.991 mm and dia.0.762 mm overlap each other in one place,we suggest only dia.0.991mm remain there.

8.在DRD孔表中直径0.012英寸孔数是291，而在钻孔文件中孔数是290，请确认孔数是290而不是291。

The quantity of diameter 0.012 inch in the hole chart of file DRD is 291, but(thruhole,tap) it is only 290. please confirm the quantity of diameter 0.012 inch holes in the drill flie should be 290 not 291.

9.在孔表中标明1.7*1.9mm的槽数量为4个，但gerber中仅有两个，建议按gerber制作。

In the drilldraw file,it stated that the quantity of slots 1.7*1.9mm is 4 ,but we have found two slots in the gerber file ,we suggest as per gerber file.

10.因为铣外形没有定位孔，我们建议附边加四个Φ2.0mm孔。

As no located holes for our routing,we suggest four additional holes with dia.2.0mm

in waste tab.

五、阻焊层

1．在字符"J3"处，一些0.065 inch & 0.0461 inch的孔两面没有开窗，未避免阻焊污染焊盘，在对孔双面加开窗。

On the location of "J3",some holes of diameter 0.065 inch & 0.0461 inch have not mask opening on both sides, we would like to add mask opening for these holes to avoid solder resist encroach the solder pad on both sides.

2.这些焊盘仅TOP面有阻焊开窗，为了避免油墨渗上焊盘，我们建议在BOTTOM面也加上与TOP面等大的阻焊开窗

These pads have single side mask opening on the top side , we suggest extra mask opening on the bottom side with same size as pads to avoid mask onto pad.

3.我们发现6个直径0.8MM的孔双面没有阻焊开窗，我们认为它们应为元件孔，建议双面加直径1.75MM的阻焊开窗。

We found the 6 holes with dia.0.8mm have not solder-mask opening on both sides. We think they should be component holes. We suggest putting dia.1.75mm solder mask opening on their pads on both sides.

4.我们发现单板内有些光标点没开窗，这点我们应该按原设计吗？

We found some fiducials without mask opening in the unit.Should we following the original design?

5.锡珠，小挡点

根据原设计多数过孔没有开窗，它们也没有堵孔要求，在我们生产过程中，因为孔内没充满绿油锡将会流进这些孔内，为此我们有三种建议：

建议1：允许部分过孔孔内有锡珠。

建议2：若不同意建议1，我们将对这些孔双面加一比孔大些的开窗，使用这种方法的结果是：这些过孔的孔壁不会有绿油，过孔焊盘被绿油覆盖但有部分锡环。

建议3：若不同意以上两点，我们将对双面未开窗的过孔进行堵孔，但这将增加成本和增加制程时间，对我们来说这种是最不利的选择。

我们希望你能选择建议1或建议2。

Most vias have no solder mask opening as per original design and no vias-plugged request .During our process, the solder will flow into the vias ,for they aren't filled with solder resist completely.So our suggestion have three:

suggestion1 :Solder ball in partial vias is permitted.Pls confirm.

suggestion2: If you don't agree with our suggestion 1, we would like to put an opening with a size little larger than holes on both side .In this way,the wall of the vias will have no any solder resist ,one partial pads will be soldered and the other will be covered with solder resist.Pls confirm.

suggestion3: If you don't agree with above two,we will have to plug those vias which have no opening on both side with solder resist . But it will increase our production cost and cause lead-time much. It is the worst way for us.

We would like to hope you could choose our suggestion 1or 2.

9. 过孔要求堵孔，但一些过孔顶层有开窗，建议保留过孔开窗且对Φ0.46mm的过孔堵孔。

The via is specified to be plugged. But some vias have mask opening in top layer. We suggest all vias with dia.0.406mm will be plugged and their mask opening in top layer will be kept.

12. 根据原设计光标点开窗压到周围的些线或盘，建议削光标点开窗，避免露线。

In the borad ,some soldermask opening of fiducial marks cover the nearby traces or pads on top side per original design. We suggest that shave a little soldermask opening of fiducial marks to avoid the trace exposed .

14. 开窗与线路盘现状不同，我们应该修改开窗使按键处全部上金还是依据原设计制作？

The solder mask opening shape mismatch the circuit pad , should we modify the solder mask opening shape to assure all the key pad will be covered with gold completely , or we will follow Gerber to do .

15. 能我们使用太阳PSR 2000油墨代替太阳PSR 4000油墨？因为我们没有这类型的油墨。

Can we use the solder-mask type with TAYO ink PSR 2000 instead of TAYO ink PSR 4000 H85?because we have not this type

六、字符层

1.大部分的丝印字符都在焊盘上。我们建议此板没有白字，如果需要丝印字符，我们建议删去上焊盘的字符。

Most of silkscreen is on the pads, we suggest no silkscreen, if we need to do silkscreen we suggest removal of those which are on pads.

2.原设计白油上焊盘，为了避免油墨污染焊盘，我们建议削去上焊盘的白油，请确认。

There is white ink on the top pads per original design, We suggest shaving the white ink in case of they contaminate pads. Pls confirm.

3.一些字符靠近焊盘，恐怕它们会污染焊盘，建议允许削少许字符，也就是说字符残缺是允许的。

Some legends are close to pads .we are afraid they will contaminate the pads.so we suggest shaving them a bit.that is to say the defective legends is permittable.

4.GERBER文件没有发现丝印层，因此建议此板没有字符，如果需要丝印字符，请将字符文件发给我们。

We didn't find any silkscreen layer in gerber file. So we suggest no silkscreen layers .If need ,Pls send us the file.

5.在U1和U5区域，两个IC焊盘的间距只有0.3MM ，如果按原设计制作，白油会污染焊盘，要不白油做少许更改，白油上焊盘是允许的。

In U1 & U5 area the gap between two IC pads is only 0.3mm and the white ink will contaminate pads if we follow the original gerber, the other is to make minor change to white ink and IC pads contaminated is allowed.Pls confirm.

6.按原设计，字符在大锡面上，是否为了避免白油污染锡面需要削掉白油，或者需要我们按原设计制作？请指示

The notation just lie on the large solder pad per original design , if need us to shave ink to avoid ink contaminate the solder pad or need us to follow gerber to do? please advise.

7. 所有底层字符都没镜像，建议没有底层字符或如果要做出他们需要镜像，请提出你的建议。

All the legends on bottom side are no mirror per gerber file,we suggest no bottom side silkscreen or they are mirror if we need to do them.Pls advise.

8．在GM4层有些字符，我们忽略它们或是加到顶层？

There are some legends on the GM4,should we omit them or put them on top side silkscreen?

9.由于单元比较小，没有足够的空间加我们的UL标志及周期在每个单元内，我们只能丝印我们的UL标志及周期在附边。

As the unit is so small ,there is no large enough bare space to add our UL logo and date code in each unit we have to add our UL logo and date code on the waste tab by silkscreen.

10.我们发现其他制造商的标志及周期在附边上，我们建议用我们的UL标志及周期替代加在附边上（同样板一样），请确认。

We find the LOGO and the date code of other PCB manufacture is only in waste tab. We suggest using our LOGO instead.(is only in waste tab the same as the sample.).Pls confirm.

11.顶层字符模糊不清，是否按3.bmp图示修改？

The legend is illegibility on the top layer silkscreen. Should we modify it as 3.bmp?

12.板外有些字符和线路，建议删去,请确认。

There are some circuit & notation out of the board,we suggest delete them.pls confirm.

13. 字符层有些网格间距仅有0.076mm,对我们生产来说间距太小，建议按图示修改。

In top silkscreen layer, There is some grids.But the space is only 0.076mm .The space is too small to produce. We suggest modifying these grids like 3.bmp shown.

七、外形层

1. *.DWG中没体现拼板方向，建议拼板按照我们附件中的图所示。

We suggest panelization per our attached drawing for it does not show the unit-pcb's exact direction in the *.DWG.

2. 单板外形与拼板外形不重合，建议按单板调整外形。

The unit outline cann’t match the panel profile.We suggest following the unit outline to modify.

3. 标注尺寸与实测尺寸不同，建议以标注尺寸为准。

The actual gerber dimension is different from the description in drill chart.we suggest per actual gerber.

4.建议v-cut留厚按前版本0.3+/-0.1mm控制。

We suggest the remain of the v-cut line as per old version.(0.3+/-0.1mm).

5.要求的v-cut角度是30-45度，但我V-CUT 刀是30, 45,60度，它们的公差是+/-5度，因此我们建议V-CUT角度30+/-5是允许的。

The angle of V-CUT is specified 30-45 degree.But our normal reamer of V-CUT is only 30， 45,60 degree.Their tolerance is +/-5 degree .So we have to suggest the angle of V-CUT 30+/-5 degree is permitted.

6.建议附边与拼板相连以增加强度。

We suggest waste tabs connected around the panel to have it stronger.

7. 在gerber 文件中我们没有发现有外形层，请发外形文件给我们，否则我们无法制作。

We did not find the outline of the board in gerber file ,please send outline gerber file to us,otherwise we can not manufature this board .

8. 依据原设计槽宽仅有1.0mm，是否允许我们扩大成2.0mm，以提高生产效率？

The solts are only 1.0mm in original gerber,can we expand them to 2.0mm to improve our production efficiency?

10. 此板尺寸较大，而邮票孔间距仅有0.15mm,建议增加间距到0.45以提高板的强度。

The gap between snap off holes is only 0.15mm,and the size of board is large. We suggest decreasing the snap off holse (dia.0.599mm) to 0.45mm to get the web stronger.

六、叠层

1.在文件中未指定叠层顺序，我们确认叠层顺序为：top--gnd--In1--In2--pwr—bot。

In the Gerber file, the layup sequence did not be defined, we would like to confirm the layup sequence is as below:top--gnd--In1--In2--pwr--bot.

2. 此板叠层有特殊要求（见图2”A”所示），但我们没有40mil的芯板（注：不含铜厚），我们不得不建议叠层按图2”B”所示制作。

The board stack-up is specified.(see A of picture2),but we haven't no 40mil core.

We have to suggest board stack-up per B of picture2.

3.文件readme.txt规定芯板的厚度是0.7+/-0.1MM，我们不能确定0.7MM是否包含铜箔的厚度，我们想确定0.7MM是不含铜厚的，请确认

In the readme.txt file ,it is specified that the thickness of inner core is 0.7+/-0.1mm , we don’t know if the core 0.7mm include the copper or not , we would like to confirm the core 0.7mm excluding copper foil ,please confirm

4. 文件readme.txt规定内层的铜箔厚度是18UM ，但我们没有0.7MM 18/18UM的芯板，为了缩短产品的交货时间，我们是否可以使用35UM铜箔0.7MM的芯板？请确认。

In the readme.txt file ,it stated that 18/18um copper inner layer ,but we have not 0.7mm core with 18um copper thickness now ,in order to shorten the lead time of production , can we use 0.7mm core with 35um copper ?

PCB SPECIAL ENGLISH

1.PCB=Printed Circuit Board 电路板	47.Silkscreen 丝印字符
2.CAM=Computer aided manufacture计算机辅助	48.HAL=HASL=Hot air(Solder)leveling 热风整平喷锡
3.Pad 焊盘	49.Routing 锣板,铣板
4.Annular ring 焊环	50.Punching 冲板,啤板
5.AOI=automatic optical inspection 自动光学检测	51.FOC=final quality checking 终检,最后检查
6.Charge of free 免费	52.FOA=final quality audit 最后稽查(抽查)
7.WIP=work in process 在线板	53.Shippment 出货
8.DCC=document control center 文控中心	54.Flux 松香
9.Legend 字符	55.Au金,Cu铜,Ni镍,Pb铅,Tn锡,Tin-lead锡铅合金
10.CS=Component Side =Top Side （顶层）元件面	56.Lead free 无铅
11.SS=Solder Side =Bottom Side （底层）焊锡面	57.COC=compliance of certificate 材料证明书
12.Gold Plated 电金，镀金	58.Microsection=cross section 微切片,横切片
13.Nickel Plated 电镍，镀镍	59.Chamical gold 沉镍金
14.Immersion Gold 沉金=沉镍金	60.Mould=punch die 模具,啤模
15.Carbon Ink Print 印碳油	61.MI=manufacture instruction 制作批示
16.Microsection Report 切片报告，横切面报告	62.QA=quality assurance 品质保证
17.X-out=Cross-out 打“X”报告	63.CAD=computer aided design 计算机辅助设计
18.Panel （客户称）拼板，（生产线称）工作板	64.Drill bit size钻咀直径<diameter>
19.Marking 标记，UL 标记	65.Bow and twist 板弯和板曲
20.Date code 生产周期	66.Hit 击打,孔数
21.Unit 单元，单位	67.Bonding 邦定,点焊
22.Profile 外形，轮廓<outline>	68.Test coupon 测试模块(科邦)
23.Profile By Routing 锣(铣)外形	69.Thieving copper 抢电流铜皮
24.Wet Film 湿菲林,湿绿油,湿膜	70.Rail-web
25.Slot 槽,方坑	71.Break-up tab 工艺边
26.Base Material=Base Laminate 基材,板料	72.Break away tab 工艺边
27.V-out =V-score V形槽	73.GND=ground 地线,大铜皮
28.Finished 成品	74.Hole edge 孔边,孔内
29.Marketing 市场部	75.Stamp hole 邮票孔
30.Gerber File GERBER文件	76.Template 天坯,型板,钻孔样板(首板)
31.UL LOGO UL标记	77.Dry film 干菲林,干膜
32.E-Test=Electric Open/Short Test 电子测试	78.LPI=liquid photo image 液态感光=湿绿油
33.PO=Purchase Order 订单	79.Multilayer 多层板
34.Tolerance 公差	80.SMD=surface mouted device 贴片,表面贴装器件
35.Rigid,Flexible Board 刚性,软性板	81.SMT=surface mouted technology 表面贴装技术
36.Board cut 开料	82.Peelable mask=blue gel 蓝胶
37.Board baking 焗板	83.Tooling hole 工艺孔,管位,定位孔,工具孔
38.Drill 钻孔	84.Fiducial mask 测光点,光学对位点,对光点,电眼
39.PTH=Plated Through Hole 镀通孔,沉铜	85.Copper foil 铜箔
40.Panel plating 板面电镀,全板电镀	86.Dimension 尺寸
41.Photo Image 图象,线路图形	87.Nagative负的,positive正的
42.Pattern plating 线路电镀	88.Flash gold 闪镀金,镀薄金
43.Etching 蚀板,蚀刻	89.Engineering department 工程部
44.SM=Solder Mask 防焊,阻焊,绿油	90.Delivery date 交货期
45.SR=Solder Resist 防焊,阻焊,绿油	91.Bevelling 斜边
46.Gold finger 金手指	92.Spacing=gap 间隙,气隙,线隙

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